来源:华尔街见闻

  dào2025nián,HBMdegōngyīngwèi-11%,zhěngDRAMshìchǎngdegōngyīngwèi-23%。biéshìHBMde求量jiāngzēngjiānéngzhànzǒngDRAMgōngyīngde30%上。

  人gōngzhìnéng求推dòngdiéjiāguòliǎngniánběnchūnèicúnshìchǎng正迎来前suǒyǒudechāozhōu”。

  shìdānzàizhōude报告zhōngchūcúnjiāngchūxiàn“前suǒyǒudegōngshīhéngnèicúndejiàzhǎnggāo

gōngzhìnéngde发展jiāng导致DRAMHBMdegōngshīhéng2025niánHBMdegōngyīngwèi-11%,zhěngDRAMshìchǎngdegōngyīngwèi-23%。biéshìHBMde求量jiāngzēngjiānéngzhànzǒngDRAMgōngyīngde30%。

yóuDRAMgōngyīngjiāzhīguòliǎngniándeběnchūméiyǒude晶圆chǎng规模晶圆用,这jiāngwèinèicúnshìchǎngchāozhōugōngdòng

nèicúndejiàjiāngzhǎnggāoshāngpǐncúnchǎnpǐndejiàjiāngzài2024niánliǎngwèizhǎng,2025niánHBMdejiàjiānggāo,服务器DRAMchāogāoQLC固态yìngjiāngyǐnjiàzhǎng

  进步来看,zàinèicúnshìchǎngzhōngde战略地wèidegōng司SK海shìsānxīngshìchǎngfènéjiāngzēngzhǎng

jiāngnèicúnxíng2024-25niánde每股shōugāo了24-82%,jiàozuìdeshígāochū51-54%;

SK海shìjiāngzhànáotóu,我menwèishìchǎngshíduìshìchǎngfènézēngzhǎng估了。zài2025niánjiāngzhàn据HBMshìchǎngdezuìfèné,利润jiānggāojiāngbiāojiàgāo11%zhì30万hányuánjiàoyǒu约30%dezhǎngjiānsānxīngdiànzibiāojiàgāozhì10.5万hányuánjiàoyǒu36%上zhǎngjiān

  这cúnzhōuyǒusuǒ

  chū,从史来看,nèicúnshìchǎngzhōu性明显,zhōuzhěng体路jìng相似。shìběntóuzhōujiàozhǎngkuòchǎnnéngyào2-3érgōngchǎng建设yào2-3nián

nèicúnxíng通常每liǎngniánchūxiànduǎnzàndegōnghéng,这种zhōushìyóu半导体制造dezhǎngběntóuzhōudòngdechǎnnéngkuòzhōuzhōngchǎnnéngdekuò张通常yào2-3ér新晶圆chǎngde建设tóuchǎnyào2-3nián

xíngzhōu原因duō样,bāo括互联wǎngyún算、新冠病gōngzhìnéng等,这些因素使得gōngjiāngzhōuwèixiàn象,但新dechǎnnéngwǎngwǎngzàixíngzuìyàodehòu上线。

大摩:新一轮内存“超级周期”,2025年将出现“前所未有”的供需失衡

  但这zhōuyǒusuǒ同,chū

guò去相dāngzhōuzhōngxíngdeběnchūchíchǎnnéngsuǒde水平,2022niánsānchǎnnéngzàijiàng

这种tóude正发生zàinèicúngōngyīngxùnzhuǎndàoHBMdezhī际,HBM每suǒde晶圆容量shì普通DRAMdeliǎng倍,chǎnjiào

  dào2025nián,HBMshìchǎngfènézhànjiāngzēngzhǎngzhěngshìchǎnggōngyīngjiāng更明显:

dào2025nián,HBMzǒng寻址shìchǎng(TAM)jiāng显著zēngzhǎng,从2025niánde370亿měiyuánzēngzhǎngdào2027niánde700亿měiyuánshìchǎngfènéjiāngzhànzhěngDRAMshìchǎngde30%上,混合jiàjiāngzhǎng10%上。

从2025niánkāi始,zhìnéngshǒudiàndegōngzhìnéngshēngzhōunéngyàoéwàidenèicúnchǎnnéngshìchǎng届时jiāngmiàn临严重degōngyīngduǎn缺,HBMdegōngyīngwèi-11%,zhěngDRAMshìchǎngdegōngyīngwèi-23%。

大摩:新一轮内存“超级周期”,2025年将出现“前所未有”的供需失衡

  jiàmiàn,SK海shìsānxīngdiànzizài积极kuò展HBMDRAMdechǎnnéng2024niánèrDRAM合同jiàjiānghuánzhǎng13-18%,sānnéngzhǎng10-15%。shìdān利表示:

gěishōujiàbiāo变化,我menjiāngDRAMNANDdesāndìngjià展望分bié上调zhì13%20%,érzhīdewèiDRAM 8%NAND 10%。客xíngwèi发生了变化,确bǎogōngyīngyuèyuèduōyōudìngjià,来zhōngde订单zhìnéngshǒu机oemyīnggāishēngdàosān,PC ODM/ oemjiāngbǎonèicúngōngyīng,同时wèi某些型PC oembǎochí接近20zhōudecúnxíngchǎn量仍求,减chǎnzàiérhuándegǎiwèi24nián下半niándejià前景带来了更dedìng性。

  xíngtóugōngshìchǎngfènéjiāngzēngzhǎng

  AI驱dòngdenèicúnchāozhōujiāngwèiSK海shìsānxīngdiànzi带来fènédezēngzhǎngjiāngSK海shìbiāojiàgāo11%zhì30万hányuánjiàoyǒu约30%dezhǎngjiānshì2024nián2025niánde每股shōujiāngshìchǎnggāochū59%,海shì2024niánsānde绩指yǐnjiāng会更gāo

  jiāngsānxīngdiànzibiāojiàgāozhì10.5万hányuánjiàoyǒu36%上zhǎngjiān,并指chūsānxīngdiànzi获得yīng伟达dezài2025niánjiāngzhì关重yàoduìsānxīng来说,zuìde结果shìnián获得HBM3E避免GPUchūxiàn任何gōngyīngzhōng断。zuìzāodekuàngshìsānxīngnéngyàojiāngchāoguò50亿GbdeHBM晶圆chǎnnéngzhuǎnxiàngshāngpǐnDRAMshìchǎng。如果sānxīngdeHBM晶圆chǎnnéngzhuǎnxiàngDRAM,这néngduìDRAMshìchǎnggōngyīngchǎn生显著yǐng响,zēngjiāgōngyīngzēngzhǎng

大摩:新一轮内存“超级周期”,2025年将出现“前所未有”的供需失衡

  shìchǎngyǒu风险,tóu谨慎。běn构成tóu建议,未考虑dàobiéshūdetóubiāocáizhuàngkuàngyào。用yīng考虑běnzhōngde任何意见、观点或结lùnshì否符合dìngzhuàngkuàng。据此tóu,责任